Curing mechanism of resole phenolic resin based on variable temperature FTIR spectra and thermogravimetry-mass spectrometry

To solve the problem that curing mechanism evolution of phenolic resin catalyzed by Ba(OH) 2 remained unclear, p-p methylene index, o-p o-o hydroxymethyl and ether index were introduced to quantitatively investigate chemical structure in temperature range 90–230°C. The structures investigated variable FT-IR. gas products released with increase characterized Thermogravimetry-Mass Spectrometry. from 90°C 230°C was concluded finally. results show main reaction is formation group 90–120°C. It difficult form bridge at this stage. In 120–160°C, group. From 160°C 190°C, reactions are breaking bond, carbonyl propyl bridge. Above polycondensation among hydroxyl groups, groups. bond breaks completely above 230°C. This work provides a new method mechanism. benefit for rational design process resin-based composites.